Qualcomm
Cambridge, UK
General Summary: About the Role The Central Hardware Systems Team at Qualcomm has an opening for an IC Package Design Engineer. The team is responsible for road mapping, architecting, design methodology, design implementation, and verification for all Qualcomm package products. Principal Duties and Responsibilities will include: Responsible for Package/SIP physical design and layout, optimization, DV, and tape out. Work with multi-functional teams to achieve optimized mechanical, electrical RF & SI/PI, and thermal performance for various classes of chips. Work with IC Physical Design team on top level floor planning including hard macro block placement, Redistribution Layer, and bump/ball pattern/assignment. Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution. Explore, evaluate, and develop new CAD tools, design, and verification flows. Work with marketing/IC/product...